JPH0337310B2 - - Google Patents
Info
- Publication number
- JPH0337310B2 JPH0337310B2 JP19758385A JP19758385A JPH0337310B2 JP H0337310 B2 JPH0337310 B2 JP H0337310B2 JP 19758385 A JP19758385 A JP 19758385A JP 19758385 A JP19758385 A JP 19758385A JP H0337310 B2 JPH0337310 B2 JP H0337310B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum nitride
- insulating substrate
- heat dissipating
- substrate
- nitride ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 34
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000010949 copper Substances 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19758385A JPS6258664A (ja) | 1985-09-09 | 1985-09-09 | 放熱性絶縁基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19758385A JPS6258664A (ja) | 1985-09-09 | 1985-09-09 | 放熱性絶縁基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6258664A JPS6258664A (ja) | 1987-03-14 |
| JPH0337310B2 true JPH0337310B2 (en]) | 1991-06-05 |
Family
ID=16376900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19758385A Granted JPS6258664A (ja) | 1985-09-09 | 1985-09-09 | 放熱性絶縁基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6258664A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123352U (en]) * | 1988-02-15 | 1989-08-22 | ||
| JPH04162756A (ja) * | 1990-10-26 | 1992-06-08 | Toshiba Corp | 半導体モジュール |
| JP2002043632A (ja) * | 2000-07-21 | 2002-02-08 | Citizen Electronics Co Ltd | 発光ダイオード |
-
1985
- 1985-09-09 JP JP19758385A patent/JPS6258664A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6258664A (ja) | 1987-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4585706A (en) | Sintered aluminum nitride semi-conductor device | |
| US4352120A (en) | Semiconductor device using SiC as supporter of a semiconductor element | |
| CA2330885C (en) | Ceramic heater | |
| JP3338495B2 (ja) | 半導体モジュール | |
| JPS61176142A (ja) | 基板構造体 | |
| US7433187B2 (en) | Heat spreader module | |
| JP2883787B2 (ja) | パワー半導体装置用基板 | |
| JPS60173900A (ja) | セラミツクス回路基板 | |
| JP5707896B2 (ja) | ヒートシンク付パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法 | |
| JP3176815B2 (ja) | 半導体装置用基板 | |
| JPH05347469A (ja) | セラミックス回路基板 | |
| JPS5831755B2 (ja) | 電気絶縁用基体 | |
| JPH0337310B2 (en]) | ||
| JPH1067560A (ja) | 高熱伝導率セラミックスおよびその製造方法 | |
| JP2011187511A (ja) | 窒化珪素基板およびそれを用いた半導体モジュール | |
| JPH0590444A (ja) | セラミツクス回路基板 | |
| JP3794454B2 (ja) | 窒化物セラミックス基板 | |
| JPS62216251A (ja) | 高熱伝導性基板 | |
| JPH0320067A (ja) | セラミック放熱フィン付半導体装置 | |
| JP4476428B2 (ja) | 窒化アルミニウム回路基板およびその製造方法 | |
| JP2503778B2 (ja) | 半導体装置用基板 | |
| CN114220781B (zh) | 电路基板及制备方法及绝缘栅双极型晶体管模块 | |
| JPH0369189B2 (en]) | ||
| JP2001160676A (ja) | セラミックス回路基板 | |
| JPH03261672A (ja) | 窒化アルミニウムと金属材とからなる接合体の構造 |